Copper clad polyimide film

Quick Details

Supply Ability

Supply Ability: 400000 Roll/Rolls per Month

Packaging & Delivery

Packaging Details: Packed in cardboard box with fumigation free pallete or non-wood pallete

Port: HongKong, Shenzhen, Humen, Shanghai

Lead Time:

Copper clad polyimide film

Polyimide film is a fire retardant film, can be used in many areas.

Copper foil has a good performance in EMI/RMF shielding

This foil can be used for PCB, cable shielding, fire retardant layer. and many other usings.

Thickness and width are all customzied. we can also coat acrylic adhesive glue on the copper side or the polyimide film side.

Contact us and send us your specifications, and we will quote you our best price.

Other shielding and insulation materials can be cusotmzied too.

PI Copper-Clad Flexible Laminate

Structure and Materials

Polyimide (PI) Film: Exhibits exceptional heat resistance, mechanical strength, and tear resistance. Its long-term operating temperature range is -269°C to 260°C, with short-term tolerance up to 400°C. It also offers excellent chemical stability and a low loss factor, ensuring high-frequency signal integrity.

Copper Foil: Provides superior electrical conductivity and shielding performance, enabling stable current transmission and electromagnetic interference (EMI) shielding.

Adhesive: Bonds the PI film and copper foil together, ensuring structural stability of the flexible laminate.

Features

Outstanding Flexibility: The combination of PI film and copper foil allows for three-dimensional wiring, enabling shape adaptation to spatial constraints. It can be folded or bent to fit complex layouts and application scenarios.

Excellent Electrical Performance: PI copper-clad laminates feature extremely low resistivity and superior EMI shielding. The dielectric constant of PI material is approximately 3.8, making it ideal for high-frequency signal transmission.

Dimensional Stability: The PI film’s ultra-low thermal expansion coefficient closely matches that of copper foil, minimizing deformation or dimensional changes under varying temperatures. This ensures reliable performance under diverse conditions.

Classification

Adhesive-Free Double-Sided Substrate: Composed of copper foil pressed onto PI film, it is suitable for flexible laminates requiring high expansion and elongation, such as those used in Apple products for high-speed data transmission.

Adhesive-Free Single-Sided Substrate: Also made by pressing copper foil onto PI film, it is used in multilayer flexible printed circuit (FPC) boards and the outer layers of rigid-flex boards. Its comprehensive product structure meets various thickness requirements for flexible laminates and rigid-flex stack-ups.

Applications

Consumer Electronics: Widely used in wearables, foldable smartphones, tablets, and other devices.

Automotive Electronics: Employed in dashboards, infotainment systems, airbags, and other components. It remains stable under high-temperature conditions (e.g., engine compartments) and during vehicle vibrations.

Medical Devices: For instance, in endoscope serpentine structures, FPCs must endure ±180° repeated bending. Using 50μm PI substrate + 35μm rolled copper foil with edge-sealing adhesive technology, the laminate can withstand 50,000 bending cycles in bodily fluid environments.

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