Nickel-plated copper foil tape

Nickel-plated copper foil tape,EMI / RFI Shielding,ESD Protection,Electrical Conduction,Enhanced Corrosion and Oxidation Resistance, Dual‑Function Shielding + Grounding,High‑Temperature and Chemical Resistance


Product description

Function and Application

   This product is an electromagnetic shielding tape,the main function is electrostatic discharge,electromagnetic shielding ,heat conduction and heat dissipation .Widely used in electronic products such as mobile phones,tablets,computers,televisions,drones and other electronic appliances.
1.EMI / RFI Shielding

   The nickel layer provides excellent shielding performance, effectively blocking electromagnetic interference. It is widely used in electronic devices, cables, displays, mobile phone accessories, and more.

2.ESD Protection

   It quickly dissipates static electricity to protect sensitive electronic components. Common applications include electronic product assembly, PCBs, and lithium‑battery manufacturing.
3.Electrical Conduction

   The copper foil offers high conductivity, while the nickel layer enhances corrosion resistance. It is suitable for grounding, circuit connections, signal transmission, and other electrical applications.
4.Enhanced Corrosion and Oxidation Resistance

   The nickel coating protects the copper foil from oxidation, extending its service life. Ideal for long‑term exposure or humid environments.
5.Dual‑Function Shielding + Grounding

   It provides both electromagnetic shielding and grounding capabilities. Widely used in electronic device enclosures, FPC flexible circuits, automotive electronics, and more.
6.High‑Temperature and Chemical Resistance

   Suitable for use in high‑temperature spraying, powder coating, battery manufacturing, and other industrial processes.
 
 
 

Production Instructions:

-Base material:Copper Foil 

-Adhesive:Conductive Acrylic Achesive

-Release:Release paper

-Color:Silver

-Standard size:0.05mm*500mm*50m 

 

Relative Data:

-Acrylic adhesive has good adhesion to most material surfaces,high viscosity,firm viscosity,no residue

-X-Y/Z axis direction has good conduction performance

-Copper foil has good heat dissipation performance

- Copper foil substrate has excellent EMI shielding and ESD function

 

Product Construction:

Typical Physical Properties:

 

Project

Value

Nickel Thickness(mm)

0.003±0.002

Thickness of rolled copper foil substrate (mm)

0.018±0.002

Total Thickness(mm)

0.05±0.01

Peeling Strength of Steel Plste(kg/25mm)

≥1.0

Holding Power(H,1000g)

>48

Heat Resistance(℃)

-10~120

Shielding Effectiveness(dB)

>85

X-Y Direction Electrical Resistance(Ω)

≤0.05

Z direction Electrical Resistance(Ω)

≤0.03

Nickel-Plated resistance(Ω)

≤0.03

Peel force test:

(1)X-Y Direction Electrical Resistance(Horizontal conductivity)

1.Put the tape under  530g±5g copper block and make sure to paste it evenly;

2.Turn on the resistance and rean the value after 60 Seconds;        

Surroundings: Temperature:23±2 ;Humidity:65%±5%


(2)Z Dection Electrical Resistance(Vertical conductivity)

1.Place the tape between the two 1KG Copper blacks and make sure to stick yt evenly

2.Turn on the resistance tester and read the number after 60 seconds;

Surroundings:Temperature:23±2Humidity:65%

 

Storage and Shelf life:

  Store in original cartons at 25±5℃ and 50±20% relative humidity.If stored under proper conditions,product retains its performance and properties for six months from date of manufacture.

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