Papua New Guinea High-temperature resistant polyimide film
Flexible High-Temperature Electrical Insulation Film in 12.5–250 μm Thicknesses,Electrical insulation in electronic components and assemblies.
Category:
Papua New GuineaCable insulation material
Product Description
Quick Overview
- Material: polyimide film.
- Verified thickness range: 12.5–250 μm.
- Thirteen listed thickness grades.
- Long-term heat resistance: ≥180°C for all listed grades.
- Dielectric strength: ≥140–245 kV/mm, depending on thickness.
- Tensile strength: ≥130–150 MPa, depending on thickness.
- Minimum slit width: 10 mm.
- Available core inside diameters: 52 mm and 76.2 mm.
- Custom width and length are available subject to production confirmation.
Product Description
Polyimide film is a flexible, high-temperature-resistant insulation film designed for demanding electrical and industrial applications. The supplied product range covers thin films from 12.5 μm to 100 μm and thicker films from 125 μm to 250 μm. Each grade has defined basis weight, tensile strength, breaking elongation, dielectric strength and long-term heat-resistance values.
The combination of electrical insulation, mechanical strength and long-term heat resistance makes the film suitable for applications in semiconductors, smart cards, electronics, automotive components and general manufacturing.
Key Benefits
- Wide thickness selection from 12.5 to 250 μm.
- Long-term heat resistance of at least 180°C across all listed grades.
- High dielectric strength for electrical-insulation designs.
- Mechanical properties matched to the selected thickness grade.
- Precision slitting from 10 mm width.
- Plastic-core rewinding options with 52 mm or 76.2 mm inside diameter.
Technical Specifications — 12.5 to 100 μm
Thickness (μm) | Basis Weight (g/m²) | Tensile (MPa) | Elongation (%) | Dielectric Strength (kV/mm) | Long-Term Heat Resistance (°C) |
12.5 ± 3 | 18 ± 3 | ≥140 | ≥40 | ≥210 | ≥180 |
15 ± 3 | 21 ± 4 | ≥140 | ≥40 | ≥210 | ≥180 |
25 ± 3 | 35 ± 5 | ≥140 | ≥40 | ≥245 | ≥180 |
30 ± 3 | 42 ± 5 | ≥140 | ≥40 | ≥230 | ≥180 |
50 ± 3 | 70 ± 5 | ≥140 | ≥40 | ≥220 | ≥180 |
75 ± 3 | 105 ± 5 | ≥150 | ≥50 | ≥180 | ≥180 |
100 ± 3 | 145 ± 5 | ≥150 | ≥50 | ≥175 | ≥180 |
Technical Specifications — 125 to 250 μm
Thickness (μm) | Basis Weight (g/m²) | Tensile (MPa) | Elongation (%) | Dielectric Strength (kV/mm) | Long-Term Heat Resistance (°C) |
125 | 175 ± 5 | ≥150 | ≥70 | ≥170 | ≥180 |
150 | 215 ± 5 | ≥150 | ≥70 | ≥165 | ≥180 |
175 | 245 ± 5 | ≥140 | ≥80 | ≥160 | ≥180 |
200 | 280 ± 5 | ≥140 | ≥80 | ≥150 | ≥180 |
225 | 315 ± 5 | ≥130 | ≥90 | ≥145 | ≥180 |
250 | 350 ± 5 | ≥130 | ≥90 | ≥140 | ≥180 |
The values above are grade-specific requirements taken from the two supplied TDS documents. Select a grade by the complete property set rather than thickness alone. Product suitability should be verified in the final insulation system.
Electrical Properties
Property | 12.5–100 μm Grades | 125–250 μm Grades |
Volume resistivity | >1 × 10¹⁰ Ω·m (TDS condition marked at 200°C) | >1 × 10¹⁰ Ω·m |
Surface resistivity | >1 × 10¹³ Ω (TDS condition marked at 200°C) | >1 × 10¹⁴ Ω |
Dielectric constant at 50 Hz | 3.5 ± 0.4 | 3.5 ± 0.4 |
The supplied TDS documents present different surface-resistivity requirements for the thin and thick ranges. Confirm the applicable test condition and acceptance criterion for the selected grade before design approval.
Typical Applications
- Electrical insulation in electronic components and assemblies.
- High-temperature insulation layers for validated industrial designs.
- Semiconductor and smart-card manufacturing applications.
- Electrical and thermal-barrier components in automotive and general manufacturing.
- Precision-cut insulation films, spacers and die-cut components.
Slitting and Rewinding
- Minimum listed tape width: 10 mm.
- Width tolerance for widths ≤100 mm: ±0.5 mm.
- Width tolerance for widths >100 mm: ±1 mm.
- Core inside diameter: 52 mm or 76.2 mm.
- Core material: plastic.
- Custom width and length: available upon request, subject to confirmation.
How to Select the Right PI Film
- Specify the required film thickness and thickness tolerance.
- Check dielectric strength and resistivity requirements for the insulation design.
- Confirm tensile strength and elongation needed for winding, forming or die cutting.
- State the continuous service-temperature requirement.
- Provide the finished width, length, core diameter and quantity.
- Describe downstream processes such as coating, laminating, slitting or die cutting.
- Evaluate a sample in the actual assembly before mass production.
Handling, Storage and Packaging
Handle the film carefully during transportation to avoid surface or edge damage that may affect tensile performance. Store it in a ventilated warehouse, keep it away from wet floors and avoid direct sunlight. The conventional packaging stated in the TDS is carton packaging.
Send us your required thickness, width, roll format, electrical-insulation target and processing conditions. We can review the available grade and converting requirements before sampling or quotation.
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